Subroutines for some plasma surface interaction processes: physical sputtering, chemical erosion, radiation enhanced sublimation, backscattering and thermal evaporation.

Manoj Warrier Ralf Schneider Xavier Bonnin Subroutines for some plasma surface interaction processes: physical sputtering, chemical erosion, radiation enhanced sublimation, backscattering and thermal evaporation. 46-68 2004 160 Computer Physics Communications 1 http://dx.doi.org/10.1016/j.cpc.2004.02.011 db/journals/cphysics/cphysics160.html#WarrierSB04