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BibTeX record journals/corr/abs-2011-06473
@article{DBLP:journals/corr/abs-2011-06473, author = {Tae Woo Hong and Connor Myant and David E. Boyle}, title = {Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending}, journal = {CoRR}, volume = {abs/2011.06473}, year = {2020}, url = {https://arxiv.org/abs/2011.06473}, eprinttype = {arXiv}, eprint = {2011.06473}, timestamp = {Mon, 17 May 2021 13:08:09 +0200}, biburl = {https://dblp.org/rec/journals/corr/abs-2011-06473.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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