BibTeX record journals/corr/abs-2011-06473

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@article{DBLP:journals/corr/abs-2011-06473,
  author       = {Tae Woo Hong and
                  Connor Myant and
                  David E. Boyle},
  title        = {Thermoformed Circuit Boards: Fabrication of highly conductive freeform
                  3D printed circuit boards with heat bending},
  journal      = {CoRR},
  volume       = {abs/2011.06473},
  year         = {2020},
  url          = {https://arxiv.org/abs/2011.06473},
  eprinttype    = {arXiv},
  eprint       = {2011.06473},
  timestamp    = {Mon, 17 May 2021 13:08:09 +0200},
  biburl       = {https://dblp.org/rec/journals/corr/abs-2011-06473.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}