BibTeX record: journals/computer/McDonaldGSDB87

download as .bib file

@article{DBLP:journals/computer/McDonaldGSDB87,
  author    = {Jack F. McDonald and
               Hans J. Greub and
               Randy H. Steinvorth and
               Brian J. Donlan and
               Albert S. Bergendahl},
  title     = {Wafer Scale Interconnections for GaAs Packing - Applications to {RISC}
               Architecture.},
  journal   = {{IEEE} Computer},
  year      = {1987},
  volume    = {20},
  number    = {4},
  pages     = {21--35},
  url       = {http://doi.ieeecomputersociety.org/10.1109/MC.1987.1663533},
  doi       = {10.1109/MC.1987.1663533},
  timestamp = {Tue, 02 Sep 2014 21:17:49 +0200},
  biburl    = {http://dblp.uni-trier.de/rec/bib/journals/computer/McDonaldGSDB87},
  bibsource = {dblp computer science bibliography, http://dblp.org}
}