@article{DBLP:journals/computer/McDonaldGSDB87,
author = {Jack F. McDonald and
Hans J. Greub and
Randy H. Steinvorth and
Brian J. Donlan and
Albert S. Bergendahl},
title = {Wafer Scale Interconnections for GaAs Packing - Applications
to RISC Architecture},
journal = {IEEE Computer},
volume = {20},
number = {4},
year = {1987},
pages = {21-35},
ee = {http://doi.ieeecomputersociety.org/10.1109/MC.1987.1663533},
bibsource = {DBLP, http://dblp.uni-trier.de}
}