BibTeX record journals/access/TianYNW21

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@article{DBLP:journals/access/TianYNW21,
  author       = {Kaiyi Tian and
                  Senyuan Yang and
                  Jiaxuan Niu and
                  Hanxiang Wang},
  title        = {Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy
                  Resin by Incorporation of Mesogens Without Nanofillers},
  journal      = {{IEEE} Access},
  volume       = {9},
  pages        = {31575--31580},
  year         = {2021},
  url          = {https://doi.org/10.1109/ACCESS.2021.3058612},
  doi          = {10.1109/ACCESS.2021.3058612},
  timestamp    = {Tue, 23 Mar 2021 14:12:08 +0100},
  biburl       = {https://dblp.org/rec/journals/access/TianYNW21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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