BibTeX record journals/access/LiuHLLCSL21

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@article{DBLP:journals/access/LiuHLLCSL21,
  author       = {Tsung{-}Yen Liu and
                  Shih{-}Ming Huang and
                  Mu{-}Jen Lai and
                  Rui{-}Sen Liu and
                  Yi{-}Tsung Chang and
                  Wen{-}Hong Sun and
                  Ray{-}Ming Lin},
  title        = {Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating
                  AlGaN-Based {UVB} Light-Emitting Diodes},
  journal      = {{IEEE} Access},
  volume       = {9},
  pages        = {129874--129880},
  year         = {2021},
  url          = {https://doi.org/10.1109/ACCESS.2021.3111258},
  doi          = {10.1109/ACCESS.2021.3111258},
  timestamp    = {Wed, 03 Nov 2021 08:25:31 +0100},
  biburl       = {https://dblp.org/rec/journals/access/LiuHLLCSL21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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