BibTeX record conf/vts/ZhongWCC19

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@inproceedings{DBLP:conf/vts/ZhongWCC19,
  author       = {Zhanwei Zhong and
                  Tom B. Wrigglesworth and
                  Eugene M. Chow and
                  Krishnendu Chakrabarty},
  title        = {Test-Cost Reduction for 2.5D ICs Using Microspring Technology for
                  Die Attachment and Rework},
  booktitle    = {37th {IEEE} {VLSI} Test Symposium, {VTS} 2019, Monterey, CA, USA,
                  April 23-25, 2019},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/VTS.2019.8758669},
  doi          = {10.1109/VTS.2019.8758669},
  timestamp    = {Mon, 03 Jan 2022 22:16:24 +0100},
  biburl       = {https://dblp.org/rec/conf/vts/ZhongWCC19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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