BibTeX record conf/vlsit/VenkatesanLGPMM22

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@inproceedings{DBLP:conf/vlsit/VenkatesanLGPMM22,
  author       = {Suresh Venkatesan and
                  James Lee and
                  Simon Chun Kiat Goh and
                  Brian Pile and
                  Daniel Meerovich and
                  Jinyu Mo and
                  Yang Jing and
                  Lucas Soldano and
                  Baochang Xu and
                  Yu Zhang and
                  Aaron Voon{-}Yew Thean and
                  Yeow Kheng Lim},
  title        = {A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics
                  using a {CMOS} based Optical Interposer\({}^{\mbox{TM}}\)},
  booktitle    = {{IEEE} Symposium on {VLSI} Technology and Circuits {(VLSI} Technology
                  and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022},
  pages        = {381--382},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830432},
  doi          = {10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830432},
  timestamp    = {Thu, 04 Aug 2022 11:27:04 +0200},
  biburl       = {https://dblp.org/rec/conf/vlsit/VenkatesanLGPMM22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}