BibTeX record conf/syscon/DoveSH17

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@inproceedings{DBLP:conf/syscon/DoveSH17,
  author       = {Rick Dove and
                  William Schindel and
                  Robert Will Hartney},
  title        = {Case study: Agile hardware/firmware/software product line engineering
                  at Rockwell Collins},
  booktitle    = {2017 Annual {IEEE} International Systems Conference, SysCon 2017,
                  Montreal, QC, Canada, April 24-27, 2017},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/SYSCON.2017.7934807},
  doi          = {10.1109/SYSCON.2017.7934807},
  timestamp    = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl       = {https://dblp.org/rec/conf/syscon/DoveSH17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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