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BibTeX record conf/socc/SalehSAV23
@inproceedings{DBLP:conf/socc/SalehSAV23, author = {Dima Al Saleh and Yousef Safari and Fahad Rahman Amik and Boris Vaisband}, editor = {J{\"{u}}rgen Becker and Andrew Marshall and Tanja Harbaum and Amlan Ganguly and Fahad Siddiqui and Kieran McLaughlin}, title = {P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs}, booktitle = {36th {IEEE} International System-on-Chip Conference, {SOCC} 2023, Santa Clara, CA, USA, September 5-8, 2023}, pages = {1--6}, publisher = {{IEEE}}, year = {2023}, url = {https://doi.org/10.1109/SOCC58585.2023.10256905}, doi = {10.1109/SOCC58585.2023.10256905}, timestamp = {Tue, 21 Nov 2023 07:48:13 +0100}, biburl = {https://dblp.org/rec/conf/socc/SalehSAV23.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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