BibTeX record conf/socc/AbdurrobSL23

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@inproceedings{DBLP:conf/socc/AbdurrobSL23,
  author       = {Abrar Abdurrob and
                  Emre Salman and
                  Jack Lombardi},
  editor       = {J{\"{u}}rgen Becker and
                  Andrew Marshall and
                  Tanja Harbaum and
                  Amlan Ganguly and
                  Fahad Siddiqui and
                  Kieran McLaughlin},
  title        = {Thermal Integrity of ReRAM-based Near-Memory Computing in 3D Integrated
                  {DNN} Accelerators},
  booktitle    = {36th {IEEE} International System-on-Chip Conference, {SOCC} 2023,
                  Santa Clara, CA, USA, September 5-8, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/SOCC58585.2023.10256927},
  doi          = {10.1109/SOCC58585.2023.10256927},
  timestamp    = {Tue, 07 May 2024 20:08:29 +0200},
  biburl       = {https://dblp.org/rec/conf/socc/AbdurrobSL23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}