A new system for reducing the bonding process cycle time and increasing the accuracy of bonding diagram.

Chang-Joon Oh Young Joong Lee Young-Joon Han Chung Sam Ahn A new system for reducing the bonding process cycle time and increasing the accuracy of bonding diagram. 4301-4305 2004 conf/smc/2004 SMC (5) http://dx.doi.org/10.1109/ICSMC.2004.1401207 db/conf/smc/smc2004-5.html#OhLHA04