BibTeX record conf/smartgridcomm/ComdenWGFGB23

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@inproceedings{DBLP:conf/smartgridcomm/ComdenWGFGB23,
  author       = {Joshua Comden and
                  Jing Wang and
                  Subhankar Ganguly and
                  Steven Forsyth and
                  Reynaldo Gomez and
                  Andrey Bernstein},
  title        = {Hardware-in-the-Loop Evaluation of Grid-Edge {DER} Chip Integration
                  Into Next-Generation Smart Meters},
  booktitle    = {{IEEE} International Conference on Communications, Control, and Computing
                  Technologies for Smart Grids, SmartGridComm IEEE, Glasgow, United
                  Kingdom, October 31 - November 3, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/SmartGridComm57358.2023.10333873},
  doi          = {10.1109/SMARTGRIDCOMM57358.2023.10333873},
  timestamp    = {Wed, 03 Jan 2024 08:34:34 +0100},
  biburl       = {https://dblp.org/rec/conf/smartgridcomm/ComdenWGFGB23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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