BibTeX record conf/sma/Ostrovsky-Berman04

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@inproceedings{DBLP:conf/sma/Ostrovsky-Berman04,
  author       = {Yaron Ostrovsky{-}Berman and
                  Leo Joskowicz},
  editor       = {Gershon Elber and
                  Nicholas M. Patrikalakis and
                  Pere Brunet},
  title        = {Tolerance envelopes of planar mechanical parts},
  booktitle    = {Proceedings of the Ninth {ACM} Symposium on Solid Modeling and Applications,
                  Genova, Italy, June 09-11, 2004},
  pages        = {135--143},
  publisher    = {{ACM}},
  year         = {2004},
  url          = {https://dl.acm.org/citation.cfm?id=1217896},
  timestamp    = {Wed, 26 Jun 2019 20:28:30 +0200},
  biburl       = {https://dblp.org/rec/conf/sma/Ostrovsky-Berman04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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