BibTeX record conf/slip/SistoCCPBMM21

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@inproceedings{DBLP:conf/slip/SistoCCPBMM21,
  author       = {Giuliano Sisto and
                  Rongmei Chen and
                  Richard Chou and
                  Geert Van der Plas and
                  Eric Beyne and
                  Rod Metcalfe and
                  Dragomir Milojevic},
  title        = {Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs
                  At Advanced Nodes (invited)},
  booktitle    = {{ACM/IEEE} International Workshop on System Level Interconnect Prediction,
                  {SLIP} 2021, Munich, Germany, November 4, 2021},
  pages        = {17--23},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/SLIP52707.2021.00011},
  doi          = {10.1109/SLIP52707.2021.00011},
  timestamp    = {Sat, 30 Sep 2023 09:56:50 +0200},
  biburl       = {https://dblp.org/rec/conf/slip/SistoCCPBMM21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}