BibTeX record conf/slip/Karnik21

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@inproceedings{DBLP:conf/slip/Karnik21,
  author       = {Tanay Karnik},
  title        = {Recent Advances and Future Challenges in 2.5D/3D Heterogeneous Integration
                  (Invited)},
  booktitle    = {{ACM/IEEE} International Workshop on System Level Interconnect Prediction,
                  {SLIP} 2021, Munich, Germany, November 4, 2021},
  pages        = {x},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/SLIP52707.2021.00007},
  doi          = {10.1109/SLIP52707.2021.00007},
  timestamp    = {Fri, 21 Jan 2022 09:18:37 +0100},
  biburl       = {https://dblp.org/rec/conf/slip/Karnik21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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