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BibTeX record conf/slip/Karnik21
@inproceedings{DBLP:conf/slip/Karnik21, author = {Tanay Karnik}, title = {Recent Advances and Future Challenges in 2.5D/3D Heterogeneous Integration (Invited)}, booktitle = {{ACM/IEEE} International Workshop on System Level Interconnect Prediction, {SLIP} 2021, Munich, Germany, November 4, 2021}, pages = {x}, publisher = {{IEEE}}, year = {2021}, url = {https://doi.org/10.1109/SLIP52707.2021.00007}, doi = {10.1109/SLIP52707.2021.00007}, timestamp = {Fri, 21 Jan 2022 09:18:37 +0100}, biburl = {https://dblp.org/rec/conf/slip/Karnik21.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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