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BibTeX record conf/slip/ChenSZMWPB22
@inproceedings{DBLP:conf/slip/ChenSZMWPB22, author = {Rongmei Chen and Giuliano Sisto and Odysseas Zografos and Dragomir Milojevic and Pieter Weckx and Geert Van der Plas and Eric Beyne}, editor = {Mustafa Badaroglu and Shantanu Dutt}, title = {Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside {(BS)} Connection: Invited Paper}, booktitle = {Proceedings of the 24th {ACM/IEEE} Workshop on System Level Interconnect Pathfinding, {SLIP} 2022, San Diego, California, 3 November 2022}, pages = {3:1--3:5}, publisher = {{ACM}}, year = {2022}, url = {https://doi.org/10.1145/3557988.3569716}, doi = {10.1145/3557988.3569716}, timestamp = {Fri, 22 Mar 2024 08:49:56 +0100}, biburl = {https://dblp.org/rec/conf/slip/ChenSZMWPB22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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