BibTeX record conf/slip/ChenSZMWPB22

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@inproceedings{DBLP:conf/slip/ChenSZMWPB22,
  author       = {Rongmei Chen and
                  Giuliano Sisto and
                  Odysseas Zografos and
                  Dragomir Milojevic and
                  Pieter Weckx and
                  Geert Van der Plas and
                  Eric Beyne},
  editor       = {Mustafa Badaroglu and
                  Shantanu Dutt},
  title        = {Opportunities of Chip Power Integrity and Performance Improvement
                  through Wafer Backside {(BS)} Connection: Invited Paper},
  booktitle    = {Proceedings of the 24th {ACM/IEEE} Workshop on System Level Interconnect
                  Pathfinding, {SLIP} 2022, San Diego, California, 3 November 2022},
  pages        = {3:1--3:5},
  publisher    = {{ACM}},
  year         = {2022},
  url          = {https://doi.org/10.1145/3557988.3569716},
  doi          = {10.1145/3557988.3569716},
  timestamp    = {Fri, 22 Mar 2024 08:49:56 +0100},
  biburl       = {https://dblp.org/rec/conf/slip/ChenSZMWPB22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}