BibTeX record conf/sbcci/RemyCPMP08

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@inproceedings{DBLP:conf/sbcci/RemyCPMP08,
  author       = {Laurent Remy and
                  Philippe Coll and
                  Fabrice Picot and
                  Philippe Mico and
                  Jean{-}Michel Portal},
  editor       = {Marcelo Lubaszewski and
                  Michel Renovell and
                  Rajesh K. Gupta},
  title        = {Metal filling impact on standard cells: definition of the metal fill
                  corner concept},
  booktitle    = {Proceedings of the 21st Annual Symposium on Integrated Circuits and
                  Systems Design, {SBCCI} 2008, Gramado, Brazil, September 1-4, 2008},
  pages        = {16--21},
  publisher    = {{ACM}},
  year         = {2008},
  url          = {https://doi.org/10.1145/1404371.1404387},
  doi          = {10.1145/1404371.1404387},
  timestamp    = {Fri, 24 Dec 2021 10:43:45 +0100},
  biburl       = {https://dblp.org/rec/conf/sbcci/RemyCPMP08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}