BibTeX record conf/nems/YeWYQH18

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@inproceedings{DBLP:conf/nems/YeWYQH18,
  author       = {Yizhou Ye and
                  Zhenjun Wang and
                  Zhenxiang Yi and
                  Ming Qin and
                  Qing{-}An Huang},
  title        = {Annular-Encapsulation Packaging to Realize High-Performance {MEMS}
                  Thermal Wind Sensor},
  booktitle    = {13th {IEEE} Annual International Conference on Nano/Micro Engineered
                  and Molecular Systems, {NEMS} 2018, Singapore, Singapore, April 22-26,
                  2018},
  pages        = {456--459},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/NEMS.2018.8557002},
  doi          = {10.1109/NEMS.2018.8557002},
  timestamp    = {Sun, 04 Aug 2024 19:38:32 +0200},
  biburl       = {https://dblp.org/rec/conf/nems/YeWYQH18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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