BibTeX record conf/nems/FarisiHT16

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@inproceedings{DBLP:conf/nems/FarisiHT16,
  author       = {Muhammad Salman Al Farisi and
                  Hideki Hirano and
                  Shuji Tanaka},
  title        = {Wafer-level vacuum packaging for hetero-integration by thermo-compression
                  bonding using planarized-electroplated gold bumps},
  booktitle    = {11th {IEEE} Annual International Conference on Nano/Micro Engineered
                  and Molecular Systems, {NEMS} 2016, Sendai, Japan, April 17-20, 2016},
  pages        = {573--577},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/NEMS.2016.7758317},
  doi          = {10.1109/NEMS.2016.7758317},
  timestamp    = {Thu, 14 Oct 2021 10:18:57 +0200},
  biburl       = {https://dblp.org/rec/conf/nems/FarisiHT16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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