BibTeX record conf/nems/ChuangLHLY14

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@inproceedings{DBLP:conf/nems/ChuangLHLY14,
  author       = {Ho{-}Chiao Chuang and
                  Wei{-}Hong Lai and
                  Chih{-}Chung Huang and
                  Ai{-}Ho Liao and
                  Chih{-}Kuang Yeh},
  title        = {Fabrication of through-silicon vias {(TSV)} by nickel electroplating
                  in supercritical {CO2}},
  booktitle    = {9th {IEEE} International Conference on Nano/Micro Engineered and Molecular
                  Systems, {NEMS} 2014, Waikiki Beach, HI, USA, April 13-16, 2014},
  pages        = {108--112},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/NEMS.2014.6908770},
  doi          = {10.1109/NEMS.2014.6908770},
  timestamp    = {Tue, 24 Jan 2023 16:59:18 +0100},
  biburl       = {https://dblp.org/rec/conf/nems/ChuangLHLY14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}