BibTeX record conf/metroi/KimOK21

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@inproceedings{DBLP:conf/metroi/KimOK21,
  author       = {Eungchul Kim and
                  Seungjun Oh and
                  Taesung Kim},
  title        = {Development of Eddy Current Sensor for Measuring Thickness of Copper
                  Wafer in sub-Micron Scale},
  booktitle    = {{IEEE} International Workshop on Metrology for Industry 4.0 {\&}
                  IoT, MetroInd4.0{\&}IoT 2021, Rome, Italy, June 7-9, 2021},
  pages        = {83--87},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/MetroInd4.0IoT51437.2021.9488478},
  doi          = {10.1109/METROIND4.0IOT51437.2021.9488478},
  timestamp    = {Mon, 02 Aug 2021 16:36:17 +0200},
  biburl       = {https://dblp.org/rec/conf/metroi/KimOK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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