BibTeX record conf/itc-asia/ChenLW17

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@inproceedings{DBLP:conf/itc-asia/ChenLW17,
  author       = {Hao Chen and
                  Hung{-}Chih Lin and
                  Min{-}Jer Wang},
  title        = {Fan-out wafer level chip scale package testing},
  booktitle    = {International Test Conference in Asia, ITC-Asia 2017, Taipei, Taiwan,
                  September 13-15, 2017},
  pages        = {84--89},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/ITC-ASIA.2017.8097117},
  doi          = {10.1109/ITC-ASIA.2017.8097117},
  timestamp    = {Mon, 09 Aug 2021 14:54:04 +0200},
  biburl       = {https://dblp.org/rec/conf/itc-asia/ChenLW17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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