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BibTeX record conf/isscc/WuLSYBCKKMMWYB24
@inproceedings{DBLP:conf/isscc/WuLSYBCKKMMWYB24, author = {Tony F. Wu and Huichu Liu and Huseyin Ekin Sumbul and Lita Yang and Dipti Baheti and Jeremy Coriell and William Koven and Anu Krishnan and Mohit Mittal and Matheus Trevisan Moreira and Max Waugaman and Laurent Ye and Edith Beign{\'{e}}}, title = {11.2 {A} 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at {\textless}2{\(\mu\)}m Pitch with up to 40{\%} Energy Reduction at Iso-Area Footprint}, booktitle = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2024, San Francisco, CA, USA, February 18-22, 2024}, pages = {210--212}, publisher = {{IEEE}}, year = {2024}, url = {https://doi.org/10.1109/ISSCC49657.2024.10454529}, doi = {10.1109/ISSCC49657.2024.10454529}, timestamp = {Mon, 01 Apr 2024 11:14:21 +0200}, biburl = {https://dblp.org/rec/conf/isscc/WuLSYBCKKMMWYB24.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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