BibTeX record conf/isscc/WuLSYBCKKMMWYB24

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@inproceedings{DBLP:conf/isscc/WuLSYBCKKMMWYB24,
  author       = {Tony F. Wu and
                  Huichu Liu and
                  Huseyin Ekin Sumbul and
                  Lita Yang and
                  Dipti Baheti and
                  Jeremy Coriell and
                  William Koven and
                  Anu Krishnan and
                  Mohit Mittal and
                  Matheus Trevisan Moreira and
                  Max Waugaman and
                  Laurent Ye and
                  Edith Beign{\'{e}}},
  title        = {11.2 {A} 3D integrated Prototype System-on-Chip for Augmented Reality
                  Applications Using Face-to-Face Wafer Bonded 7nm Logic at {\textless}2{\(\mu\)}m
                  Pitch with up to 40{\%} Energy Reduction at Iso-Area Footprint},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2024,
                  San Francisco, CA, USA, February 18-22, 2024},
  pages        = {210--212},
  publisher    = {{IEEE}},
  year         = {2024},
  url          = {https://doi.org/10.1109/ISSCC49657.2024.10454529},
  doi          = {10.1109/ISSCC49657.2024.10454529},
  timestamp    = {Mon, 01 Apr 2024 11:14:21 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/WuLSYBCKKMMWYB24.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}