BibTeX record conf/isscc/SeongPBLSOLKLMJCYPRS23

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@inproceedings{DBLP:conf/isscc/SeongPBLSOLKLMJCYPRS23,
  author       = {Kihwan Seong and
                  Donguk Park and
                  Gyeom{-}Je Bae and
                  Hyunwoo Lee and
                  Youngseob Suh and
                  Wooseuk Oh and
                  Hyemun Lee and
                  Juyoung Kim and
                  Takgun Lee and
                  Geonhoo Mo and
                  Sukhyun Jung and
                  Dongcheol Choi and
                  Byoung{-}Joo Yoo and
                  Sanghune Park and
                  Hyo{-}Gyuem Rhew and
                  Jongshin Shin},
  title        = {A 4nm 32Gb/s 8Tb/s/mm Die-to-Die Chiplet Using {NRZ} Single-Ended
                  Transceiver With Equalization Schemes And Training Techniques},
  booktitle    = {{IEEE} International Solid- State Circuits Conference, {ISSCC} 2023,
                  San Francisco, CA, USA, February 19-23, 2023},
  pages        = {114--115},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ISSCC42615.2023.10067477},
  doi          = {10.1109/ISSCC42615.2023.10067477},
  timestamp    = {Wed, 29 Mar 2023 15:53:39 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/SeongPBLSOLKLMJCYPRS23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}