BibTeX record conf/isscc/LeeYK22

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@inproceedings{DBLP:conf/isscc/LeeYK22,
  author       = {Sangyoon Lee and
                  Jaekwang Yun and
                  Suhwan Kim},
  title        = {A 78.8fJ/b/mm 12.0Gb/s/Wire Capacitively Driven On-Chip Link Over
                  5.6mm with an FFE-Combined Ground-Forcing Biasing Technique for {DRAM}
                  Global Bus Line in 65nm {CMOS}},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2022,
                  San Francisco, CA, USA, February 20-26, 2022},
  pages        = {454--456},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/ISSCC42614.2022.9731653},
  doi          = {10.1109/ISSCC42614.2022.9731653},
  timestamp    = {Mon, 21 Mar 2022 14:54:56 +0100},
  biburl       = {https://dblp.org/rec/conf/isscc/LeeYK22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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