@inproceedings{DBLP:conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09,
  author    = {Uksong Kang and
               Hoeju Chung and
               Seongmoo Heo and
               Soon-Hong Ahn and
               Hoon Lee and
               Sooho Cha and
               Jaesung Ahn and
               Dukmin Kwon and
               Jin Ho Kim and
               Jaewook Lee and
               Han-Sung Joo and
               Woo-Seop Kim and
               Hyun-Kyung Kim and
               Eun-Mi Lee and
               So-Ra Kim and
               Keum-Hee Ma and
               Dong-Hyun Jang and
               Nam-Seog Kim and
               Man-Sik Choi and
               Sae-Jang Oh and
               Jung-Bae Lee and
               Tae-Kyung Jung and
               Jei-Hwan Yoo and
               Changhyun Kim},
  title     = {8Gb 3D DDR3 DRAM using through-silicon-via technology},
  booktitle = {ISSCC},
  year      = {2009},
  pages     = {130-131},
  ee        = {http://dx.doi.org/10.1109/ISSCC.2009.4977342},
  crossref  = {DBLP:conf/isscc/2009},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}

@proceedings{DBLP:conf/isscc/2009,
  title     = {IEEE International Solid-State Circuits Conference, ISSCC
               2009, Digest of Technical Papers, San Francisco, CA, USA,
               8-12 February, 2009},
  booktitle = {ISSCC},
  publisher = {IEEE},
  year      = {2009},
  isbn      = {978-1-4244-3458-9},
  ee        = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4926119},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}