BibTeX record conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09

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@inproceedings{DBLP:conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09,
  author       = {Uksong Kang and
                  Hoeju Chung and
                  Seongmoo Heo and
                  Soon{-}Hong Ahn and
                  Hoon Lee and
                  Sooho Cha and
                  Jaesung Ahn and
                  Dukmin Kwon and
                  Jin Ho Kim and
                  Jaewook Lee and
                  Han{-}Sung Joo and
                  Woo{-}Seop Kim and
                  Hyun{-}Kyung Kim and
                  Eun{-}Mi Lee and
                  So{-}Ra Kim and
                  Keum{-}Hee Ma and
                  Dong{-}Hyun Jang and
                  Nam{-}Seog Kim and
                  Man{-}Sik Choi and
                  Sae{-}Jang Oh and
                  Jung{-}Bae Lee and
                  Tae{-}Kyung Jung and
                  Jei{-}Hwan Yoo and
                  Changhyun Kim},
  title        = {8Gb 3D {DDR3} {DRAM} using through-silicon-via technology},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2009,
                  Digest of Technical Papers, San Francisco, CA, USA, 8-12 February,
                  2009},
  pages        = {130--131},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/ISSCC.2009.4977342},
  doi          = {10.1109/ISSCC.2009.4977342},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}