BibTeX record conf/isscc/ChoPYKCKKKCLSJK24

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@inproceedings{DBLP:conf/isscc/ChoPYKCKKKCLSJK24,
  author       = {Jeonghoon Cho and
                  You Jang Pyeon and
                  Junyeong Yeom and
                  Hyunjoong Kim and
                  Sanghyeon Cho and
                  Yonggi Kim and
                  Taejung Kim and
                  Jong{-}Hyun Kwak and
                  Geonjun Choi and
                  Yoonsik Lee and
                  Heungjoo Shin and
                  Hoon Eui Jeong and
                  Jae Joon Kim},
  title        = {33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch
                  Interface with On-Chip Application Tunable Time-Domain Feature Extraction},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2024,
                  San Francisco, CA, USA, February 18-22, 2024},
  pages        = {554--556},
  publisher    = {{IEEE}},
  year         = {2024},
  url          = {https://doi.org/10.1109/ISSCC49657.2024.10454293},
  doi          = {10.1109/ISSCC49657.2024.10454293},
  timestamp    = {Tue, 19 Mar 2024 09:04:31 +0100},
  biburl       = {https://dblp.org/rec/conf/isscc/ChoPYKCKKKCLSJK24.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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