BibTeX record conf/isscc/0002TPZCKSTNZSG18

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@inproceedings{DBLP:conf/isscc/0002TPZCKSTNZSG18,
  author       = {John M. Wilson and
                  Walker J. Turner and
                  John W. Poulton and
                  Brian Zimmer and
                  Xi Chen and
                  Sudhir S. Kudva and
                  Sanquan Song and
                  Stephen G. Tell and
                  Nikola Nedovic and
                  Wenxu Zhao and
                  Sunil R. Sudhakaran and
                  C. Thomas Gray and
                  William J. Dally},
  title        = {A 1.17pJ/b 25Gb/s/pin ground-referenced single-ended serial link for
                  off- and on-package communication in 16nm {CMOS} using a process-
                  and temperature-adaptive voltage regulator},
  booktitle    = {2018 {IEEE} International Solid-State Circuits Conference, {ISSCC}
                  2018, San Francisco, CA, USA, February 11-15, 2018},
  pages        = {276--278},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/ISSCC.2018.8310291},
  doi          = {10.1109/ISSCC.2018.8310291},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/0002TPZCKSTNZSG18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}