Design quality tradeoff studies for 3D ICs built with nano-scale TSVs and devices.

Kaiyuan Yang Dae Hyun Kim Sung Kyu Lim Design quality tradeoff studies for 3D ICs built with nano-scale TSVs and devices. 740-746 2012 ISQED http://dx.doi.org/10.1109/ISQED.2012.6187574 conf/isqed/2012 db/conf/isqed/isqed2012.html#YangKL12