BibTeX record conf/isqed/KumariCM23

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@inproceedings{DBLP:conf/isqed/KumariCM23,
  author       = {Vandana Kumari and
                  Maya Chandrakar and
                  Manoj Kumar Majumder},
  title        = {Performance Analysis of Cylindrical Through Silicon Via with Interfacial
                  Crack},
  booktitle    = {24th International Symposium on Quality Electronic Design, {ISQED}
                  2023, San Francisco, CA, USA, April 5-7, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ISQED57927.2023.10129400},
  doi          = {10.1109/ISQED57927.2023.10129400},
  timestamp    = {Thu, 01 Jun 2023 22:31:44 +0200},
  biburl       = {https://dblp.org/rec/conf/isqed/KumariCM23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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