BibTeX record conf/isqed/Cruz04

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@inproceedings{DBLP:conf/isqed/Cruz04,
  author       = {Roderick P. Cruz},
  title        = {Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation
                  Using {TDR}},
  booktitle    = {5th International Symposium on Quality of Electronic Design {(ISQED}
                  2004), 22-24 March 2004, San Jose, CA, {USA}},
  pages        = {190--195},
  publisher    = {{IEEE} Computer Society},
  year         = {2004},
  url          = {https://doi.org/10.1109/ISQED.2004.1283672},
  doi          = {10.1109/ISQED.2004.1283672},
  timestamp    = {Thu, 23 Mar 2023 23:58:32 +0100},
  biburl       = {https://dblp.org/rec/conf/isqed/Cruz04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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