BibTeX record conf/ispec2/LeiQWXJB23

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@inproceedings{DBLP:conf/ispec2/LeiQWXJB23,
  author       = {Zhengfei Lei and
                  Hu Qin and
                  Haitao Wu and
                  Jiang Xingliang and
                  Liu Jie and
                  Jiankang Bao},
  title        = {Method for monitoring the icing thickness of ground wire using sag
                  measurement technology (iSPEC 2023)},
  booktitle    = {{IEEE} Sustainable Power and Energy Conference, iSPEC 2023, Chongqing,
                  China, November 28-30, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/iSPEC58282.2023.10403032},
  doi          = {10.1109/ISPEC58282.2023.10403032},
  timestamp    = {Thu, 22 Feb 2024 20:17:11 +0100},
  biburl       = {https://dblp.org/rec/conf/ispec2/LeiQWXJB23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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