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BibTeX record conf/ispd/ZhuCPSYL20
@inproceedings{DBLP:conf/ispd/ZhuCPSYL20, author = {Lingjun Zhu and Kyungwook Chang and Dusan Petranovic and Saurabh Sinha and Yun Seop Yu and Sung Kyu Lim}, editor = {William Swartz and Jens Lienig}, title = {Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs}, booktitle = {{ISPD} 2020: International Symposium on Physical Design, Taipei, Taiwan, March 29 - April 1, 2020, delayed to September 20-23, 2020}, pages = {39--46}, publisher = {{ACM}}, year = {2020}, url = {https://doi.org/10.1145/3372780.3378169}, doi = {10.1145/3372780.3378169}, timestamp = {Sun, 02 Oct 2022 16:10:03 +0200}, biburl = {https://dblp.org/rec/conf/ispd/ZhuCPSYL20.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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