BibTeX record conf/ispd/Zhang22

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@inproceedings{DBLP:conf/ispd/Zhang22,
  author       = {Ming Zhang},
  editor       = {Laleh Behjat and
                  Stephen Yang},
  title        = {3DIC Design: Challenges and Opportunities in System-of-Chips Integration},
  booktitle    = {{ISPD} 2022: International Symposium on Physical Design, Virtual Event,
                  Canada, March 27 - 30, 2022},
  pages        = {81},
  publisher    = {{ACM}},
  year         = {2022},
  url          = {https://doi.org/10.1145/3505170.3511473},
  doi          = {10.1145/3505170.3511473},
  timestamp    = {Thu, 14 Apr 2022 15:02:18 +0200},
  biburl       = {https://dblp.org/rec/conf/ispd/Zhang22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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