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BibTeX record conf/ispd/Lay24
@inproceedings{DBLP:conf/ispd/Lay24, author = {Wang{-}Tyng Lay}, editor = {Iris Hui{-}Ru Jiang and Gracieli Posser}, title = {Unified 3D-IC Multi-Chiplet System Design Solution}, booktitle = {Proceedings of the 2024 International Symposium on Physical Design, {ISPD} 2024, Taipei, Taiwan, March 12-15, 2024}, pages = {83}, publisher = {{ACM}}, year = {2024}, url = {https://doi.org/10.1145/3626184.3635279}, doi = {10.1145/3626184.3635279}, timestamp = {Mon, 01 Apr 2024 11:14:09 +0200}, biburl = {https://dblp.org/rec/conf/ispd/Lay24.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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