BibTeX record conf/isocc/YoonKSPKPKK23

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@inproceedings{DBLP:conf/isocc/YoonKSPKPKK23,
  author       = {Jiwon Yoon and
                  Hyunwoo Kim and
                  Boogyo Sim and
                  Hyunwook Park and
                  Yi{-}Gyeong Kim and
                  Sujin Park and
                  Youngsu Kwon and
                  Joungho Kim},
  title        = {Multi-Stripline Redistribution Layer Interposer Channel Design for
                  High Bandwidth Memory Module Considering Via Interconnect},
  booktitle    = {20th International SoC Design Conference, {ISOCC} 2023, Jeju, Republic
                  of Korea, October 25-28, 2023},
  pages        = {247--248},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ISOCC59558.2023.10396127},
  doi          = {10.1109/ISOCC59558.2023.10396127},
  timestamp    = {Thu, 22 Feb 2024 20:44:54 +0100},
  biburl       = {https://dblp.org/rec/conf/isocc/YoonKSPKPKK23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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