BibTeX record conf/isocc/KimHJK23

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@inproceedings{DBLP:conf/isocc/KimHJK23,
  author       = {Sunghoon Kim and
                  Donghyun Han and
                  Seokjun Jang and
                  Sungho Kang},
  title        = {{LOTS:} Low Overhead {TSV} Repair Method Using {IEEE-1838} Standard
                  Architecture},
  booktitle    = {20th International SoC Design Conference, {ISOCC} 2023, Jeju, Republic
                  of Korea, October 25-28, 2023},
  pages        = {289--290},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ISOCC59558.2023.10395943},
  doi          = {10.1109/ISOCC59558.2023.10395943},
  timestamp    = {Tue, 27 Feb 2024 16:41:39 +0100},
  biburl       = {https://dblp.org/rec/conf/isocc/KimHJK23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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