BibTeX record conf/isocc/JongKyungSM23

download as .bib file

@inproceedings{DBLP:conf/isocc/JongKyungSM23,
  author       = {Park Jong{-}Kyung and
                  Park Sang{-}Woo and
                  Jeong Min{-}Seong},
  title        = {Advancements in Metal Passivation Process for Low-Temperature Cu-Cu
                  Direct Bonding},
  booktitle    = {20th International SoC Design Conference, {ISOCC} 2023, Jeju, Republic
                  of Korea, October 25-28, 2023},
  pages        = {223--224},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ISOCC59558.2023.10396380},
  doi          = {10.1109/ISOCC59558.2023.10396380},
  timestamp    = {Thu, 22 Feb 2024 20:44:54 +0100},
  biburl       = {https://dblp.org/rec/conf/isocc/JongKyungSM23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.