BibTeX record conf/islped/ZhuTLMXDKRJCL21

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@inproceedings{DBLP:conf/islped/ZhuTLMXDKRJCL21,
  author       = {Lingjun Zhu and
                  Tuan Ta and
                  Rossana Liu and
                  Rahul Mathur and
                  Xiaoqing Xu and
                  Shidhartha Das and
                  Ankit Kaul and
                  Alejandro Rico and
                  Doug Joseph and
                  Brian Cline and
                  Sung Kyu Lim},
  title        = {Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture},
  booktitle    = {{IEEE/ACM} International Symposium on Low Power Electronics and Design,
                  {ISLPED} 2021, Boston, MA, USA, July 26-28, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/ISLPED52811.2021.9502481},
  doi          = {10.1109/ISLPED52811.2021.9502481},
  timestamp    = {Sat, 30 Sep 2023 09:50:26 +0200},
  biburl       = {https://dblp.org/rec/conf/islped/ZhuTLMXDKRJCL21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}