BibTeX record conf/iscas/YousufHC17

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@inproceedings{DBLP:conf/iscas/YousufHC17,
  author       = {Abdul Hamid Bin Yousuf and
                  Nahid M. Hossain and
                  Masud H. Chowdhury},
  title        = {Impacts of different shapes of through-silicon-via core on 3D {IC}
                  performance},
  booktitle    = {{IEEE} International Symposium on Circuits and Systems, {ISCAS} 2017,
                  Baltimore, MD, USA, May 28-31, 2017},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/ISCAS.2017.8050434},
  doi          = {10.1109/ISCAS.2017.8050434},
  timestamp    = {Wed, 16 Oct 2019 14:14:49 +0200},
  biburl       = {https://dblp.org/rec/conf/iscas/YousufHC17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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