BibTeX record conf/iscas/VendraC18

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@inproceedings{DBLP:conf/iscas/VendraC18,
  author       = {Satya K. Vendra and
                  Malgorzata Chrzanowska{-}Jeske},
  title        = {Buffered-Interconnect Performance and Power Dissipation in 3D ICs
                  with Temperature Profile},
  booktitle    = {{IEEE} International Symposium on Circuits and Systems, {ISCAS} 2018,
                  27-30 May 2018, Florence, Italy},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/ISCAS.2018.8351416},
  doi          = {10.1109/ISCAS.2018.8351416},
  timestamp    = {Thu, 14 Oct 2021 10:40:55 +0200},
  biburl       = {https://dblp.org/rec/conf/iscas/VendraC18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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