BibTeX record conf/iscas/SeoG07

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@inproceedings{DBLP:conf/iscas/SeoG07,
  author       = {Dongwon Seo and
                  Yuhua Guo},
  title        = {Mismatch Compensated Design Techniques under Packaging-Induced Die
                  Stress},
  booktitle    = {International Symposium on Circuits and Systems {(ISCAS} 2007), 27-20
                  May 2007, New Orleans, Louisiana, {USA}},
  pages        = {3788--3791},
  publisher    = {{IEEE}},
  year         = {2007},
  url          = {https://doi.org/10.1109/ISCAS.2007.378786},
  doi          = {10.1109/ISCAS.2007.378786},
  timestamp    = {Wed, 16 Oct 2019 14:14:49 +0200},
  biburl       = {https://dblp.org/rec/conf/iscas/SeoG07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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