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BibTeX record conf/irps/TsuchiyaSSAOASN19
@inproceedings{DBLP:conf/irps/TsuchiyaSSAOASN19, author = {Hideaki Tsuchiya and Naohito Suzumura and Ryuji Shibata and Hideki Aono and Makoto Ogasawara and Toshihiko Akiba and Kenji Sakata and Kazuyuki Nakagawa and Takuo Funaya}, title = {Electromigration Early Failures for Cu Pillar Interconnections with an {ENEPIG} Pad Finish and its Suppression}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2019, Monterey, CA, USA, March 31 - April 4, 2019}, pages = {1--6}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/IRPS.2019.8720501}, doi = {10.1109/IRPS.2019.8720501}, timestamp = {Wed, 16 Oct 2019 14:14:55 +0200}, biburl = {https://dblp.org/rec/conf/irps/TsuchiyaSSAOASN19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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