BibTeX record conf/irps/TsuchiyaSSAOASN19

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@inproceedings{DBLP:conf/irps/TsuchiyaSSAOASN19,
  author       = {Hideaki Tsuchiya and
                  Naohito Suzumura and
                  Ryuji Shibata and
                  Hideki Aono and
                  Makoto Ogasawara and
                  Toshihiko Akiba and
                  Kenji Sakata and
                  Kazuyuki Nakagawa and
                  Takuo Funaya},
  title        = {Electromigration Early Failures for Cu Pillar Interconnections with
                  an {ENEPIG} Pad Finish and its Suppression},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2019, Monterey,
                  CA, USA, March 31 - April 4, 2019},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/IRPS.2019.8720501},
  doi          = {10.1109/IRPS.2019.8720501},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/TsuchiyaSSAOASN19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}