BibTeX record conf/irps/PaulKGS18

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@inproceedings{DBLP:conf/irps/PaulKGS18,
  author       = {Milova Paul and
                  Boeila Sampath Kumar and
                  Harald Gossner and
                  Mayank Shrivastava},
  title        = {Contact and junction engineering in bulk FinFET technology for improved
                  ESD/latch-up performance with design trade-offs and its implications
                  on hot carrier reliability},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {3},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353573},
  doi          = {10.1109/IRPS.2018.8353573},
  timestamp    = {Thu, 14 Oct 2021 10:37:09 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/PaulKGS18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}