BibTeX record conf/irps/NguyenOM20

download as .bib file

@inproceedings{DBLP:conf/irps/NguyenOM20,
  author       = {Khai Nguyen and
                  Ernie Opiniano and
                  Randolph Mah},
  title        = {Backside Die-Edge and Underfill Fillet Cracks Induced by Additional
                  Tensile Stress from Increasing Die-to-Package Ratio in Bare-Die {FCBGA}},
  booktitle    = {2020 {IEEE} International Reliability Physics Symposium, {IRPS} 2020,
                  Dallas, TX, USA, April 28 - May 30, 2020},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2020},
  url          = {https://doi.org/10.1109/IRPS45951.2020.9129218},
  doi          = {10.1109/IRPS45951.2020.9129218},
  timestamp    = {Thu, 30 Jul 2020 15:14:26 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/NguyenOM20.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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