BibTeX record conf/irps/LinLLLTCCSC23

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@inproceedings{DBLP:conf/irps/LinLLLTCCSC23,
  author       = {Y. H. Lin and
                  C. C. Lee and
                  C. Y. Liao and
                  M. H. Lin and
                  W. C. Tu and
                  Robin Chen and
                  H. P. Chen and
                  Winston S. Shue and
                  Min Cao},
  title        = {A Novel Methodology to Predict Process-Induced Warpage in Advanced
                  {BEOL} Interconnects},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10117795},
  doi          = {10.1109/IRPS48203.2023.10117795},
  timestamp    = {Wed, 24 May 2023 09:43:44 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LinLLLTCCSC23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}