BibTeX record conf/irps/LeeLLKJLHKP23

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@inproceedings{DBLP:conf/irps/LeeLLKJLHKP23,
  author       = {S. Lee and
                  N.{-}H. Lee and
                  K. W. Lee and
                  J. H. Kim and
                  J. H. Jin and
                  Y. S. Lee and
                  Y. C. Hwang and
                  H. S. Kim and
                  S. Pae},
  title        = {Development and Product Reliability Characterization of Advanced High
                  Speed 14nm {DDR5} {DRAM} with On-die {ECC}},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10117889},
  doi          = {10.1109/IRPS48203.2023.10117889},
  timestamp    = {Wed, 24 May 2023 09:43:44 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LeeLLKJLHKP23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}