BibTeX record conf/irps/KimJCCCCLPBU22

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@inproceedings{DBLP:conf/irps/KimJCCCCLPBU22,
  author       = {Seongkyung Kim and
                  Ukjin Jung and
                  Seungjin Choo and
                  Kihyun Choi and
                  Tae{-}Jin Chung and
                  Shin{-}Young Chung and
                  Euncheol Lee and
                  Juhun Park and
                  Deokhan Bae and
                  Myungyoon Um},
  title        = {Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact
                  Adopted sub-5nm Logic Technology},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2022, Dallas,
                  TX, USA, March 27-31, 2022},
  pages        = {11},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/IRPS48227.2022.9764599},
  doi          = {10.1109/IRPS48227.2022.9764599},
  timestamp    = {Mon, 09 May 2022 18:11:25 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/KimJCCCCLPBU22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}