BibTeX record conf/irps/JeongKKKLCBKJSP18

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@inproceedings{DBLP:conf/irps/JeongKKKLCBKJSP18,
  author       = {Seongwon Jeong and
                  Jinseok Kim and
                  Ayoung Kim and
                  Byungwook Kim and
                  Moonsoo Lee and
                  Jaewon Chang and
                  In Hak Baick and
                  Hanbyul Kang and
                  Younggeun Ji and
                  Sangchul Shin and
                  Sangwoo Pae},
  title        = {Optimal design of dummy ball array in wafer level package to improve
                  board level thermal cycle reliability {(BLR)}},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {3},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353653},
  doi          = {10.1109/IRPS.2018.8353653},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/JeongKKKLCBKJSP18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}