BibTeX record conf/irps/HsuLWLLCHWHL15

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@inproceedings{DBLP:conf/irps/HsuLWLLCHWHL15,
  author       = {Li Chieh Hsu and
                  Yu{-}Min Lin and
                  Chien Liang Wu and
                  Wei Kun Lee and
                  Yen Chun Liu and
                  Cheng Pu Chiu and
                  Hsin Kuo Hsu and
                  Chun Yi Wang and
                  Chien Chung Huang and
                  Chin Fu Lin},
  title        = {Effects of copper {CMP} and post clean process on {VRDB} and {TDDB}
                  at 28nm and advanced technology node},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
                  CA, USA, April 19-23, 2015},
  pages        = {3},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/IRPS.2015.7112775},
  doi          = {10.1109/IRPS.2015.7112775},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/HsuLWLLCHWHL15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}